The new package-on?package (PoP) solution incorporates Samsung's application processor (AP) and Samsung's proprietary fusion memory, the OneDRAM.
By combining the two key components together in a single solution, mobile application designers can enjoy the benefits of smaller area coverage on the print circuit board, reduced inter-chip noise level and faster performance. The initial applications for the new AP + OneDRAM solution are 3G and 3.5G smart phones, and are expected to gradually expand to PMPs and PNDs.
Samsung's OneDRAM, first announced last December, fuses the memory functions that are required to interact with the modem processor and application processor into a single chip, and undertakes the role of supporting RAM for both mobile processors. This fusion semiconductor holds a shared block for the inter processor data transfer.
Samsung's S3C6400 application processor incorporates a 667MHz ARM1176 core, a high quality video streaming capability of standard definition, and interfaces supporting an SVGA LCD display, a 16M pixel camera input, and wireless connectivity such as WiFi, Bluetooth, GPS, WiBro and DVB-H.
The PoP solution integrates the mobile AP with a multi-chip package (MCP) memory solution. The MCP can be configured with different types of high density memory chips like 4Gbit NAND/OneNAND, 512Mb SDRAM and 512Mb OneDRAM.
Industry analysts expect the handsets designed for 3G high-speed downlink protocol access (HSDPA) and wireless broadband worldwide interoperability for microwave access (WiMAX) to increase from 100 million units in 2006 to 130 million units in 2008 - Samsung.
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