As advanced mobile electronics, PC and embedded applications increasingly require high-performance processing, there is an urgent need to control the heat generated by these device processors.

EMC2100 Family Aids Designers in Managing Thermal Conditions Arising from Use of High-Performance ICs in PC and Mobile Applications

AMD Joins Hyperion Partner Program as Hyperion Readies Hyperion System 9 Essbase Analytics and Hyperion System 9 Enterprise Analytics for AMD64 Windows Systems

Motorola, Inc. today announced availability of the PrPMC6001, the company's fastest Processor PMC module. The PrPMC6001 is designed to enable original equipment manufacturers (OEMs) to boost their platform compute and I/O performance while maintaining excellent power and thermal characteristics.

New NVIDIA nForce® 680a SLI™ MCP-based Motherboards with New AMD Athlon 64 FX-70 Series Processors Redefines the Ultimate PC Category

Texas Instruments Incorporated today announced that its OMAPTM 2 platform has been selected to provide compelling multimedia functionality for one of NTT DoCoMo's newest FOMA® 3G handsets, the FOMA N903i from NEC.