Samsung Electronics America Inc., the market leader in HDTVs, is proud to announce the company will be continuing its successful sponsorship as the Official HDTV of the NFL with a new multi-year sponsorship contract.

Sharp Corporation filed a lawsuit on August 6, 2007 (US eastern time) alleging infringements of five of its patents on LCD-related technology by Samsung Electronics Co. Ltd. (Samsung) and its US subsidiaries Samsung Electronics America, Inc. (SEA) and Samsung Telecommunications America (STA). The suit was filed in the United States District Court for the Eastern District of Texas.

Ericsson, the pioneer and world leader in 2G and 3G mobile technology, has concluded a worldwide patent license agreement with Samsung.

The newest Samsung portable computer has some amazing features, the Samsung Q1 Ultra is much more compact and smaller than the original Q1, it also has the new Intel ultra mobile processor for much better performance.

Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced today that it has become the first to begin mass producing 16 gigabit (Gb) NAND flash, the highest capacity memory chip now available.

Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced today that two chips designed for combination (contact and non-contact) smart cards, in 72KB and 144KB capacities with embedded EEPROM, have been given Common Criteria (CC) certification and an Evaluation Assurance Level (EAL) 4+ rating.

Samsung Electronics Co. Ltd., a leading provider of mobile phones and telecommunication systems, today showcased its latest Symbian OS smartphone SGH-i400 at S60 summit in Madrid, Spain.

Samsung, an official TOP Partner of the Olympic Games in wireless telecommunications equipment, concluded a sponsorship contract with the International Olympic Committee (IOC) on April 23, 2007 at the Diaoyutai State Guest h ouse in Beijing, China. Samsung first became a full sponsor of the Olympic Games during the Nagano Olympic Winter Games in 1998

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power.

Agreement covers hardware and software products, including Linux, and is expected to accelerate product development for both companies.