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TI launches Power over Ethernet controller to optimize sub-13-W designs

Expanding on the company's line of Power over Ethernet (PoE) controllers, Texas Instruments Incorporated (TI) (NYSE:TXN) introduced today a 13-W PoE powered device controller with onboard DC/DC converter specifically designed to meet the needs of IEEE 802.3af-compliant applications.

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New TI amplifiers reduce audio solution cost for flat panel TVs

Texas Instruments Incorporated (TI) introduced its second-generation, 15-W, stereo analog-input Class-D amplifiers with single-ended outputs. These highly-efficient devices eliminate components to reduce total solution size and cost in HDTVs and other consumer audio electronics. Innovative features address single-ended design challenges to ensure robust and reliable audio performance in LCD, plasma and DLP® TVs and other home audio products.

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TI releases free ZigBee& 174 2007 and ZigBee 2007 PRO software stacks

Building upon its leading portfolio of hardware and software solutions for ZigBee, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the release of the latest version of its industry-leading ZigBee-certified Z-Stack software for free download at www.ti.com/z-stack.

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TI brightens notebook LCD displays with new white LED driver

Helping display manufacturers meet demands for more efficient power technologies in displays, Texas Instruments Incorporated (TI) introduced today an innovative, six-channel, 40-V white light emitting diode (LED) driver with a built-in, high-efficiency boost regulator and 1.5-A FET.

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TI introduces flexible, dual-speed SerDes device for EPON optical line terminals

Texas Instruments (TI) (NYSE: TXN) today introduced a low-power serializer/deserializer (SerDes) device that provides a fast relock time and supports a wide data bandwidth range from 1 to 2.6 Gbps in point-to-point data transmission systems.

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TI introduces family of zero-drift, bi-directional current shunt monitors in SC70 packages

Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced a family of high- or low-side measurement, bi-directional current shunt monitor integrated circuits (ICs) in SC70 packages. Utilizing a zero-drift bi-directional architecture, the INA210 family provides outstanding accuracy up to 1 percent over the -40C to +125C temperature range, with 35uV maximum offset.

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Texas Instruments' DSP Contest cultivates technology innovation

The 2008 Texas Instruments (TI) (NYSE: TXN) Digital Signal Processing (DSP) Design Contest was held at the University of Electronic Science and Technology of China on April 25 - 27.

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TI introduces 16-Bit, 40- and 80-MSPS data converters

Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced a family of 16-bit, single channel, 40- and 80-MSPS analog-to-digital converters (ADCs) which provide the highest signal-to-noise ratio (SNR) with very low power consumption. The devices' low noise floor improves accuracy in test and measurement, receiver sensitivity in wireless communications, and image quality in medical, industrial and military applications.

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TI opens door to lighting design innovation with remote-controlled LED board

Texas Instruments Incorporated (TI) (NYSE: TXN) continues to drive advancements in the lighting industry with the introduction of a wireless remote control RGB light emitting diode (LED) design kit. The TPS62260LED plus TI's award-winning eZ430-RF2500 development tool completes a fully supported platform to design new and exciting color lighting innovations for consumer, commercial, professional and architectural applications.

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Texas Instruments powered Cable Modems achieve DOCSIS

Momentous achievement is the first step towards mass deployment of next-generation cable products and services

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TI unveils prize for top analog designs by engineering undergraduates

Texas Instruments Incorporated (TI) (NYSE: TXN) announced establishment of the Engibous Prize, $150,000 in annual awards to the engineering students who design the most innovative electronics systems using analog semiconductors. The prize is the largest of its kind and will be awarded in three regions of the world -- Asia, Europe and North America.

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TI leaps ahead to HSPA+ for wireless infrastructure applications

Enabling the trend toward 'flat architectures' for the cellular network, Texas Instruments Incorporated (TI) [NYSE: TXN] announces the availability of a development platform for the recently ratified HSPA+ (High Speed Packet Access Plus) standard.

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